Silicon Carbide Hexagonal Ceramic Tile with NIJ Level III Protection 50mm Flat Hexagon Pressureless Sintered SiC

商品の詳細:

起源の場所: 湖南省、中国
ブランド名: WNRLN
証明: ISO 9001:2015, NIJ 0101.06
モデル番号: シックタイル
書類: SIC Ballistic Armor Tiles-P...ad.pdf

お支払配送条件:

最小注文数量: 100000個
価格: USD 0.1-1 / Piece
パッケージの詳細: EPEフォームトレイ + 真空密封バッグ + 輸出グレード合板ケース
受渡し時間: 在庫に5〜7営業日、生産に15〜20日
支払条件: T/T、L/C、ウェスタンユニオン
供給の能力: 1 か月あたり 5000000 個
ベストプライス 連絡先

詳細情報

密度: 3.10~3.15 g/cm3 硬度(GPa): 24-27
曲げ強度: 380~450MPa タイルのサイズ: 50mm 平対平六角
面積密度: ≤34 kg/m² (アレイ) 破壊靱性: 3.5~4.5MPa・m1/2
ハイライト:

Hexagonal SiC Ballistic Tile

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Mosaic Array Strike Face

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NIJ III Ceramic Protection

製品の説明

Silicon Carbide Hexagonal Ceramic Ballistic Tile Mosaic Array NIJ Level III Protection Strike Face 50mm Flat Hexagon
SiC Hexagonal Ceramic Ballistic Tile
Mosaic Array Strike Face | 50mm Flat Hex | NIJ Level III
✅ Optimal Packing Density ✅ Reduced Gap Coverage
Why Hexagonal Geometry?
Traditional square tiles leave cross-shaped seams at every corner intersection—potential weak points. The WNRLN SC-50HEX-PS3 hexagonal tile distributes seam lines in a honeycomb pattern, eliminating continuous straight-line gaps. This geometric advantage provides 12-18% higher ceramic coverage density compared to equivalent square tile arrays. Each hex tile is precision-ground to ±0.2mm dimensional tolerance for consistent gap control in automated array assembly.
Hex vs Square: Coverage Density
Hexagonal tiles achieve ~90.7% geometric packing efficiency vs ~78.5% for squares of equivalent area, resulting in fewer vulnerable seam intersections and improved multi-hit resistance across the array.
SiC Hex vs B4C Hex: Cost
Atmospheric sintered SiC hex tiles cost 50-60% less than equivalent hot-pressed B4C hex tiles while delivering 90% of the ballistic performance. The ideal choice for cost-sensitive volume programs.
SiC vs Al2O3 Hex: Weight
At equivalent thickness, SiC hex arrays weigh 16-20% less than Al2O3 hex arrays. This weight saving compounds across larger panel assemblies for vehicle and personnel applications.
Seamless Multi-Tile Integration
Consistent edge chamfer (0.3mm x 45°) on all tiles ensures uniform adhesive bonding gap. Compatible with epoxy, polyurethane, and polysulfide adhesive systems for composite lamination.
Technical Specifications
Material Pressureless Sintered SiC
Shape Regular Hexagon (Flat-to-Flat)
Flat-to-Flat Width 50.0 ± 0.2 mm
Thickness 8.0 mm (6-12mm optional)
Edge Chamfer 0.3mm x 45°
Surface Finish Ground (Ra ≤ 0.8μm)
Density 3.10-3.15 g/cm³
Hardness 2500-2800 HV
Order hexagonal SiC tiles for your mosaic array system today
Email: janehu@hbnewmaterial.com | Custom hex sizes and thickness available

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